赛微电子：Fab3北京工厂持续研发硅光子通信芯片制造技术

Core Viewpoint - Saiwei Electronics is advancing its research and development in silicon photonic communication chip manufacturing technology at its Fab3 facility in Beijing, with the MEMS-OCS now entering the risk trial production phase [2]. Group 1: Company Developments - The company is focused on continuous technological breakthroughs and foundational application research related to silicon photonic communication chips [2]. - The MEMS-OCS, a core component of optical communication networks, is being developed for various applications including optical network protection, real-time optical path monitoring, fiber testing, optical device testing, optical sensing, optical add-drop multiplexing, and optical cross-connect equipment [2].