Jin Rong Jie·2025-12-17 11:13Core Viewpoint - Jinfu Technology is focusing on the development and manufacturing of external cold plate liquid cooling modules, primarily for high-power AI chips, with stable shipments in high-density computing cabinet deployments [1][3]. Group 1: Liquid Cooling Business Overview - The liquid cooling business is mainly conducted by the subsidiary Changshu Minglijia, with core products being external cold plate modules that achieve direct cooling of GPUs/CPUs through liquid circulation [1][3]. - The company does not participate in system integration but focuses on high-precision machining and welding, enhancing the value of individual projects and customer dependency [1][3]. Group 2: Technical Advantages - The company's liquid cooling solution features a compact design that is more space-efficient and adaptable compared to larger cooling solutions, enhancing deployment flexibility [2][4]. - The cold plates are constructed from copper and feature a sealed flow channel that improves heat exchange efficiency, suitable for mainstream B-series chip power levels [2][4]. Group 3: Market Position and Competitiveness - The company has established a strong competitive edge by deeply integrating into the Taiwanese high-end semiconductor and server supply chain, collaborating with key clients on advanced AI server cooling projects [2][6]. - The traditional metal processing business provides stability, while innovative material and structural projects offer flexibility, with liquid cooling being the primary growth focus [6]. Group 4: Production and Capacity - Current production capacity is fully utilized, with recent expansions completed and expected to commence operations before the Spring Festival, anticipating an increase in order volume [1][3]. - The company has achieved millions in scale shipments for cold plates and related products, with further growth expected post-expansion [1][3]. Group 5: Future Developments - The company is advancing microchannel liquid cooling technology to enhance heat exchange efficiency for next-generation chips, currently in the validation and sampling phase [5]. - Participation in the testing and sampling for the next-generation high-end AI platform, Rubin Ultra, has resulted in small trial production orders, with mass production dependent on upstream progress [5].