联得装备：在先进封装领域，公司有开发针对细间距高密度的高精度驱动芯片键合设备

Group 1 - The company, Lian De Equipment (300545), is developing high-precision bonding equipment for fine-pitch high-density driver chips in the advanced packaging sector [1] - This equipment is widely used in the packaging of high-end display chips [1]