Core Viewpoint - Recent market focus has shifted towards CPO (Co-Packaged Optics) technology, with companies like Tianfu Communication, Zhongji Xuchuang, and Xinyi Sheng showing active performance as AI computing power demands continue to surge [1] CPO Technology and Market Trends - CPO technology is seen as a key path for next-generation data center interconnects, addressing the limitations of traditional pluggable optical modules in terms of transmission speed and energy consumption [1] - Securities firms have released reports highlighting the potential of CPO and silicon photonics, with expectations that 1.6T optical modules will become a primary demand in 2024, extending the lifecycle of pluggable optical modules [1][2] - The integration of optical engines with computing chips in CPO technology raises the requirements for upstream optical chips and silicon photonics technology [2] Optical Modules and Advanced Packaging - Optical module manufacturers are crucial participants in the implementation of CPO technology, which is not expected to completely replace traditional pluggable optical modules but rather serve as a complementary or evolutionary direction in high-density, high-performance scenarios [3] - Leading optical module companies are expanding into CPO solution provision by developing core technologies such as silicon photonics and optical engines [3] Supporting Facilities and Materials - The promotion of CPO technology will drive demand for supporting facilities and specialized materials, including precision connectors and optical fiber arrays for efficient chip and optical engine coupling [4] - New packaging forms will necessitate advanced cooling solutions, potentially increasing the penetration of liquid cooling technologies [4] Company Information - Xingsen Technology has indicated that its products can be used for the packaging of CPO products, utilizing MSAP (Modified Semi-Additive Process) technology [5] - Anfu Technology has invested in Suzhou Yilong Micro Semiconductor Technology Co., which specializes in silicon photonic technology applicable to CPO optical modules, seen as a move to build a "second growth curve" [5] - Changguang Huaxin, as an IDM optical chip enterprise, is advancing its technology competitiveness in the silicon photonics field, with its 100G EML chip already in mass production and 200G EML in customer validation [5]
CPO引爆光芯片革命!硅光子龙头抢占千亿算力高地