联得装备：公司在半导体封测设备等领域已经形成了销售订单并在逐步放量

Core Viewpoint - The company has established sales orders in semiconductor packaging equipment, solid-state battery equipment, and intelligent cockpit system equipment, and is gradually increasing production capacity [1] Group 1: Business Development - The company plans to actively explore the application markets for flexible display module equipment, display front-end process bonding equipment, Mini/MicroLED equipment, VR/AR/MR precision assembly equipment, automotive intelligent cockpit system equipment, semiconductor packaging equipment, and new energy equipment in emerging fields [1] - The company will continue to increase research and development efforts for new technologies and products in these areas to support rapid business growth [1]