智通财经网·2025-12-22 03:33Core Viewpoint - ASMPT's stock rose over 4% following SK Hynix's order for new thermal compression bonding machines to support HBM4 production, indicating strong demand for advanced semiconductor manufacturing equipment [1] Group 1: Company Developments - SK Hynix has placed an order with ASMPT for a batch of new thermal compression bonding machines (TCB) to enhance HBM4 production [1] - Last month, SK Hynix ordered 7 sets of TCB systems from ASMPT, each equipped with two bonding heads, with a unit price of approximately 4 billion KRW, leading to a total contract value of around 30 billion KRW (approximately 150 million RMB) [1] Group 2: Industry Context - The decision by SK Hynix to order from ASMPT is influenced by ongoing patent disputes between local suppliers Hanmi Semiconductor and Hanwha Semiconductor, which have caused internal conflicts [1] - SK Hynix plans to order an additional 100 sets of TCB machines for HBM4 by March 2026 to support the expansion of its Cheongju M15X wafer fab, indicating a significant future demand for bonding equipment [1] - The competition for orders among ASMPT, Hanmi, and Hanwha is expected to intensify, especially if the Korean suppliers do not resolve their patent issues promptly, potentially allowing ASMPT to increase its market share or even dominate HBM4 equipment supply [1]