中科飞测：相关设备已批量销售并覆盖国内主要HBM厂商

Core Viewpoint - The company has successfully validated and is mass-selling various advanced measurement equipment for HBM packaging processes, indicating strong demand and a growing order backlog [1] Group 1: Company Developments - The company has developed and validated 3D AOI equipment, three-dimensional morphology measurement equipment, and overlay accuracy measurement equipment for HBM advanced packaging [1] - The company has achieved a significant milestone by having its equipment validated for HBM processes, which is crucial for the semiconductor industry [1] Group 2: Market Demand - The customer base for the company's equipment includes major domestic HBM manufacturers, reflecting a strong market presence [1] - There is a continuous increase in customer order volume, indicating robust demand for the company's products [1] - The company reports a healthy backlog of orders, suggesting sustained growth potential in the near future [1]