12英寸碳化硅外延晶片在厦首发

Group 1 - The company, Hantian Tiancheng, has successfully developed the world's first 12-inch high-quality silicon carbide (SiC) epitaxial wafer, which significantly improves production efficiency and reduces manufacturing costs for SiC chips, laying a crucial foundation for large-scale and low-cost applications in the SiC industry [1] - The third-generation semiconductor silicon carbide offers superior high-frequency, high-voltage, and high-temperature capabilities compared to first-generation silicon semiconductors, enabling lower energy consumption and smaller size and weight, with applications in electric vehicles, photovoltaic power generation, AI power supplies, rail transportation, smart grids, and aerospace [1] - The 12-inch wafer can carry 4.4 times more devices than the 6-inch wafer and 2.3 times more than the 8-inch wafer, significantly increasing the number of chips per wafer under the same production process [1] Group 2 - Hantian Tiancheng is the first company in China to achieve commercialized mass supply of 3-inch, 4-inch, and 6-inch silicon carbide epitaxial wafers [2] - According to a report by Zhaoshang Consulting, the company has become the largest supplier of silicon carbide epitaxial wafers globally in 2023, with a projected market share exceeding 31% in 2024 [2]