诺德股份：公司积极布局高端铜箔领域

Core Viewpoint - The company is actively positioning itself in the high-end copper foil market, anticipating significant shortages due to increased demand driven by AI in PCB applications [2] Group 1: Company Strategy - The company has successfully overcome technical challenges in producing HVLP and RTF copper foils, which include high precision equipment requirements, complex production processes, and high customer certification thresholds [2] - The company is leveraging its long-term technical accumulation and R&D capabilities to capitalize on opportunities for industrial upgrades and domestic replacements of imports [2] Group 2: Market Outlook - The high-end electronic copper foil market is expected to face significant shortages next year due to a surge in demand [2] - The company's products, including RTF-3 and HVLP-1/2, have already entered the supply chains of several leading domestic and Taiwanese manufacturers, while HVLP-3/4 products are currently in the sample testing phase [2] Group 3: Production Capacity - The company currently has a total production capacity of 140,000 tons, of which 30,000 tons are designated for high-end electronic circuit copper foil production [2]