联想申请散热装置及加工方法专利，引导散热流体的流动方向

Group 1 - Lenovo (Beijing) Co., Ltd. has applied for a patent titled "Heat Dissipation Device, Electronic Equipment, and Processing Method for Heat Dissipation Device" with publication number CN121218551A, filed on November 2025 [1] - The patent abstract reveals a heat dissipation device that includes a cavity with opposing first and second plates, where the first plate has a first region near the heat source and a second region adjacent to it [1] - Multiple columns are arranged between the first and second plates, forming guiding structures that direct the flow of heat dissipation fluid within the cavity, consisting of different first and second guiding structures [1]