强达电路:拟发行不超5.5亿元可转债投建多层板、HDI板项目

Core Viewpoint - The company plans to issue convertible bonds to raise up to 550 million yuan for a new project aimed at increasing production capacity and enhancing market competitiveness [1] Group 1: Financing and Investment - The total amount to be raised through the issuance of convertible bonds is not to exceed 550 million yuan, after deducting issuance costs [1] - The funds will be allocated to the Nantong Qiangda Circuit Technology Co., Ltd. for a project with a total investment of 1 billion yuan [1] Group 2: Project Details - The project involves the annual production of 960,000 square meters of multilayer boards and HDI boards, which has already commenced construction [1] - The construction period for the project is set at 24 months [1] Group 3: Market and Policy Alignment - The implementation of this project is expected to enhance production capacity and align with industry upgrade trends, meeting market demand [1] - The products from this project are anticipated to have a favorable market outlook and comply with national industrial policies [1]