迈为股份：长期看好HBM工艺的国产化前景

Core Viewpoint - The company is optimistic about the domestic prospects of HBM (High Bandwidth Memory) process and is focusing on developing high selectivity etching equipment and hybrid bonding equipment applicable to DRAM technology [1] Group 1 - The company expressed confidence in the long-term potential of HBM process localization [1] - The company is currently developing high selectivity etching equipment that can be used in HBM processes [1] - The company is also working on hybrid bonding equipment suitable for DRAM applications [1]