Core Viewpoint - Tongye Technology announced a major asset acquisition plan to acquire 91.69% of Beijing Siling Semiconductor Technology Co., Ltd. for approximately 561 million yuan, marking a significant asset restructuring [2][4]. Group 1: Acquisition Details - The acquisition price for the 91.69% stake in Siling Semiconductor is about 561 million yuan [2]. - The initial plan was to acquire 100% of Siling Semiconductor, but after negotiations, the acquisition ratio was adjusted to 91.69% [4]. - The transaction involves the transfer of 6% of Tongye Technology's shares from its controlling shareholders to the actual controller of Siling Semiconductor, constituting a related party transaction [6]. Group 2: Business Focus and Market Entry - Siling Semiconductor specializes in the research, design, and sales of communication chips and related products for the power IoT sector, including high-speed power line carrier communication chips [7]. - Following the acquisition, Tongye Technology will enter the power IoT communication chip market, leveraging its existing advantages in the rail transit sector [9]. - The integration of Siling Semiconductor's technology with Tongye's existing products is expected to enhance the competitiveness of Tongye's electrical products in the rail transit market [10]. Group 3: Financial Performance - In the first three quarters of 2025, Tongye Technology reported revenues of approximately 294 million yuan, a year-on-year increase of 11.97%, while net profit attributable to shareholders was about 26.61 million yuan, a decrease of 15.56% [9]. - The acquisition includes a profit commitment from Siling Semiconductor, ensuring a cumulative net profit of no less than 175 million yuan for the years 2026, 2027, and 2028 [10].
通业科技重大资产重组草案出炉！拟切入芯片赛道