Core Viewpoint - The company has completed preliminary sampling of materials such as M9 and is actively engaging with customers to provide innovative solutions for new generation computing technologies [1] Group 1: Company Developments - The company has received its first order for ultra-fast laser drilling equipment from an IC substrate customer, indicating recognition from high-end clients [1] - The ultra-fast laser drilling equipment is crucial for the packaging of high-performance computing chips like CPU, GPU, FPGA, and ASIC [1] Group 2: Industry Implications - The order reflects the company's capability to meet the precision drilling needs in advanced HDI and high-layer boards, which are essential for computing power applications [1] - The company is leveraging its ultra-fast laser drilling technology to address the demands for new materials and process upgrades in the industry [1]
英诺激光：公司于日前收到来自IC载板客户的首台超快激光钻孔设备订单