Xin Lang Cai Jing·2025-12-29 13:44Supply News - Anshi China has shipped over 11 billion chips since resuming shipments in mid-October, serving over 800 global customers [1][7] - In response to semiconductor-related disputes, Wentai Technology has initiated multiple legal proceedings in the Netherlands and submitted a dispute notice, potentially seeking international arbitration with claims up to $8 billion if unresolved within six months [1][7] Project Progress - The third phase of the Muling North Semiconductor Technology Co., Ltd. project has officially commenced production, with a total investment of 2 billion yuan and an annual capacity of 1 million 6-inch wafers, primarily for applications in new energy vehicles, industrial control, and photovoltaics [2][8] - The core equipment for the New Beauty Materials New Station Optical Functional Film project was moved in on December 25, marking significant progress, with a total investment of approximately 5 billion yuan and plans for five internationally leading intelligent display material production lines, expected to achieve mass production by the third quarter of 2026 [2][8] Corporate Dynamics - Zhongwei Company won a provincial patent award for its invention patent "Chemical Vapor Deposition Reactor or Epitaxial Layer Growth Reactor and Its Supporting Device" and also secured the gold award in the second "Changgao Competition" for high-value patent transformation [3][9] - Noreco announced on December 26 the launch of a new product series, Optical Critical Dimension (OCD) equipment NKShape, successfully delivered to a leading domestic customer, designed for advanced semiconductor processes [3][9] - Tianzhun Technology announced on December 28 the successful completion of its public offering of convertible bonds, totaling 872 million yuan, with the bonds set to be listed on the Shanghai Stock Exchange on December 31, 2025 [4][10] - Chipone announced on December 26 that its shareholder, the National Integrated Circuit Industry Investment Fund, plans to reduce its holdings by up to 8.9396 million shares, accounting for no more than 1.70% of the total share capital [4][10] - SK Hynix is accelerating the construction of its 2.5D packaging production line to enhance its overall packaging capabilities for AI semiconductors, including high bandwidth memory (HBM) [4][10] - Media reports indicate that MediaTek announced a strategic partnership with global automotive component supplier DENSO to jointly develop customized automotive system-on-chip (SoC) solutions for advanced driver assistance systems (ADAS) and smart cockpit applications [4][10]