当虹科技(688039.SH)：拟发行科技创新债券不超5亿元

Core Viewpoint - The company, Changhong Technology, has approved a proposal to issue technology innovation bonds worth up to 500 million RMB to enhance its investment in technological innovation and meet operational funding needs [1] Group 1: Company Actions - The company held its 13th meeting of the 3rd Board of Directors and the 11th meeting of the Audit Committee on December 29, 2025 [1] - The board agreed to apply for registration to issue technology innovation bonds in the interbank market [1] Group 2: Financial Strategy - The issuance of bonds aims to broaden financing channels, optimize debt structure, and reduce financial costs [1] - The maximum amount for the bond issuance is set at 500 million RMB, including the full amount [1]