罗博特科：与英伟达共同开发的全球首个300mm双面晶圆测试平台已完成可靠性测试

Core Insights - The company has successfully completed reliability testing for the world's first 300mm double-sided wafer testing platform, developed in collaboration with TSMC and NVIDIA [1] Group 1 - The collaboration involves leading technology firms, indicating a strong partnership in advancing semiconductor testing technology [1] - The completion of reliability testing marks a significant milestone in the development of innovative testing solutions for the semiconductor industry [1]