罗博特科：与英伟达等共同开发的全球首个300mm双面晶圆测试平台已完成可靠性测试

Group 1 - The core point of the article is that Robotech (300757) has successfully completed reliability testing for the world's first 300mm double-sided wafer testing platform, developed in collaboration with TSMC and NVIDIA [1] Group 2 - The collaboration involves significant industry players, indicating a strong partnership that may enhance technological advancements in semiconductor testing [1] - The completion of reliability testing marks a critical milestone for the company and could lead to potential market opportunities in the semiconductor industry [1]