Core Viewpoint - Shanghai Taosheng Electronics Technology Co., Ltd. has officially submitted its application for listing on the Sci-Tech Innovation Board, aiming to raise 1.058 billion yuan for the construction of a semiconductor testing interface and probe production base, R&D of wafer testing probe cards, and working capital supplementation, to strengthen its leading position in high-end chip testing hardware and accelerate the domestic substitution process [1] Group 1: Company Overview - Taosheng Technology is one of the earliest companies in China to independently develop chip testing interfaces and achieve large-scale production [1] - The company focuses on the semiconductor testing interface field, with products including chip testing interfaces and probe cards, which are critical for ensuring chip quality [1] - The company has developed over 4,000 chip testing interface technology solutions and possesses independent R&D and manufacturing capabilities for high-speed, high-frequency testing probes [2] Group 2: Market Position and Achievements - According to Yole, Taosheng Technology is projected to rank first in chip testing interface revenue in China and 11th globally in 2024 [2] - The company has built a broad customer ecosystem covering the entire semiconductor industry chain, serving over 700 clients, including leading companies in AI chips and autonomous driving [2] - Taosheng Technology has developed the first domestic DSA testing interface supporting parallel testing of 512 chips for Yangtze Memory Technologies, aiding the localization of the storage industry [2] Group 3: Technological Advancements - The company is expanding into the more technically challenging wafer testing probe card field, with its MEMS probe cards already commercialized for AI chip clients [3] - Taosheng Technology has achieved breakthroughs in the storage sector, with 2D MEMS products receiving orders and 2.5D MEMS products passing stringent certifications from Yangtze Memory Technologies [3] - The company is also conducting pre-research on 3D MEMS probe card technology to cover high-end storage testing scenarios [3] Group 4: Future Outlook - Taosheng Technology aims to focus on national strategic needs, pursuing high-end and large-scale development [3] - The company plans to increase R&D investment to tackle core key technologies in high-end testing interfaces, break overseas monopolies, and accelerate the domestic substitution process [3] - The goal is to further expand market share and solidify its leading position in the industry, aspiring to become a leading brand in the global semiconductor testing interface field [3]
韬盛科技科创板IPO获受理 拟募资10.58亿加码半导体测试接口国产化
Ju Chao Zi Xun·2025-12-30 15:33