豪威集团正式启动港股IPO

Core Viewpoint - Company is officially launching its Hong Kong IPO, aiming to enhance its international strategy and overseas business development while increasing its overseas financing capabilities [1] Group 1: IPO Details - The company plans to issue 45.8 million H-shares with an upper limit of HKD 104.80 per share, targeting a maximum fundraising amount of nearly HKD 4.8 billion before the green shoe option [1] - The IPO is set to start on December 31, 2025, and end on January 7, 2026, with the listing on the Hong Kong Stock Exchange scheduled for January 12, 2026 [1] - A cornerstone investor group, including international long-term funds and top private equity funds, has committed a total of HKD 2.174 billion, accounting for 45.28% of the offering [1] Group 2: Company Overview - The company is a global fabless semiconductor design firm, primarily focusing on CMOS image sensors (CIS) as its main product [1] - It operates three main business lines: image sensor solutions, display solutions, and analog solutions, providing a diverse range of image sensors, display products, analog ICs, and other semiconductor components [1] Group 3: Use of Proceeds - The funds raised from the IPO will be allocated towards research and development, global market penetration, and supporting the company's expansion in high-growth sectors and global layout [1]