Core Viewpoint - The company plans to acquire a 64.69% stake in Hangzhou Zhongxin Silicon and other related entities through a combination of issuing shares and cash payments, while also raising supporting funds from specific investors [1] Group 1: Company Overview - The company specializes in the research, production, and sales of high-end semiconductor equipment, providing etching, thin film, and MOCVD equipment to downstream manufacturers in the semiconductor industry [1] - The company's core products include critical process equipment such as high/low energy plasma etching (CCP, ICP), MOCVD, LPCVD, ALD, and EPI, with a strong international technological position in dry etching and thin film deposition [1] - The etching equipment has been applied in mass production at leading global wafer fabs, covering processes from 65nm to 5nm and maintaining a leading market share in the MOCVD sector for LED and power devices [1] Group 2: Acquisition Impact - The target company specializes in the research, production, and sales of chemical mechanical polishing (CMP) equipment, a core technology in wet processing, and is one of the few domestic companies capable of mass-producing 12-inch high-end CMP equipment [2] - This acquisition will enable the company to integrate capabilities across four core processes: etching, thin film deposition, measurement, and wet processing, marking a significant transition from dry to a comprehensive dry and wet solution [2] - The integration will fill a gap in the company's wet processing equipment offerings and enhance its ability to provide system-level solutions for advanced manufacturing processes, improving customer stickiness and accelerating penetration into mainstream production lines [2]
中微公司(688012.SH)拟发行股份购买杭州众硅64.69%股权 1月5日起复牌