壹连科技拟发行可转债募资12亿元 深化柔性电连接与电子皮肤业务

Group 1 - The company plans to issue convertible bonds to raise 1.2 billion yuan for new energy intelligent manufacturing projects and to supplement working capital, aiming to enhance its technological capabilities and industry scale [1] - The project is expected to achieve an annual production capacity of approximately 45 million new flexible electrical connection components upon completion [1] - The company aims to strengthen its partnerships with well-known domestic and international manufacturers in the new energy vehicle and energy storage sectors, enhancing customer loyalty and market competitiveness [1] Group 2 - The embodied intelligence market is projected to exceed 1 trillion yuan by 2035, with significant applications in various sectors, driving technological breakthroughs and new production models [2] - The company plans to expand its production capacity to meet the growing order demands from diverse sectors, including low-altitude economy and embodied intelligence [2] - There is an increasing demand for lightweight, high-reliability, and customized flexible printed circuits (FPC) in emerging fields, with the company developing solutions for bionic robots and electric vertical takeoff and landing (eVTOL) aircraft [2] Group 3 - The company is innovating its production line to meet both large-scale delivery requirements and the diverse, small-batch, high-complexity R&D needs of cutting-edge clients [3] - The company has been recognized as a provincial manufacturing champion in Guangdong for its core product, the cell connection component (CCS) [3] Group 4 - The company is optimizing its industrial layout by localizing the front-end manufacturing of FPC and integrating it with existing back-end processes to enhance supply chain efficiency [4] - The company has mastered the "roll-to-roll" continuous production process, capable of producing 2.5-meter ultra-long FPCs, improving product consistency and production efficiency [4] - The company will continue to invest in R&D and deepen industry-academia collaboration to empower global green transformation with competitive products and solutions [4]

Shenzhen Uniconn Technology-壹连科技拟发行可转债募资12亿元 深化柔性电连接与电子皮肤业务 - Reportify