日联科技：公司X射线检测技术和产品已广泛应用于半导体封测场景

Core Viewpoint - The company has confirmed that its X-ray detection technology and products are widely used in semiconductor packaging and testing scenarios, and it is currently advancing the verification and development of wafer detection technology and products [1] Group 1 - The company's X-ray detection technology is extensively applied in semiconductor packaging and testing [1] - The company is in the process of developing and verifying wafer detection technology and products [1] - Future updates on business progress will be disclosed in subsequent company announcements [1]