SK hynix Showcases Next Generation AI Memory Innovation at CES 2026

Core Viewpoint - SK hynix is set to showcase its next-generation AI memory solutions at CES 2026, emphasizing innovation and sustainability in the AI era [1][2]. Group 1: Exhibition Details - The company will open a customer exhibition booth at Venetian Expo from January 6 to 9, 2026, focusing on enhancing connections with key customers [1][2]. - The theme of the exhibition is "Innovative AI, Sustainable tomorrow," highlighting a range of memory solutions optimized for AI [2]. Group 2: Product Showcases - SK hynix will present its 16-layer HBM4 product with 48GB for the first time, which is an advancement from the previous 12-layer HBM4 product with 36GB that achieved speeds of 11.7Gbps [3]. - The company will also showcase the 12-layer HBM3E product with 36GB, which is expected to drive market demand this year, along with GPU modules for AI servers [4]. - A low-power memory module, SOCAMM2, specialized for AI servers will be exhibited, demonstrating the company's diverse product portfolio [4][5]. - In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, enhancing power efficiency and performance [6]. Group 3: AI System Demonstrations - An 'AI System Demo Zone' will be established for visitors to experience the company's AI system memory solutions and their integration into the AI ecosystem [7]. - The demo zone will feature customized cHBM, PIM-based AiMX, CuD, CMM-Ax, and Data-aware CSD, showcasing advanced memory technologies [8][9][10][12][13][14]. Group 4: Strategic Focus - The company aims to create new value through differentiated memory solutions and close collaboration with customers, addressing evolving technical requirements in the AI market [11][16].