联发科发布天玑8500：4nm旗舰架构，重塑中端芯格局

Core Insights - MediaTek officially launched the new Dimensity 8500 chip, positioning it as a key product for the high-end market in 2026, with a launch event scheduled for January 15 at 3 PM [1][4] Performance and Specifications - The Dimensity 8500, while targeting the mid-range market, features a core architecture close to flagship levels, promising impressive overall performance [3][4] - Utilizing TSMC's 4nm process technology, the chip enhances computational efficiency while optimizing power management for a stable and lasting user experience [3][4] - The CPU design includes an octa-core Cortex-A725 architecture, comprising one super core at 3.4GHz, three performance cores at 3.2GHz, and four efficiency cores at 2.2GHz, capable of handling high-load scenarios like gaming and multitasking while maintaining low power consumption for lighter tasks [5] Benchmark Performance - Performance tests show the Dimensity 8500 achieving an AnTuTu score exceeding 2.2 million, representing a 30% performance increase compared to the previous generation, nearing flagship chip levels [4][5] - In Geekbench 6 testing, it scored 1709 in single-core and 6532 in multi-core, placing it among the top tier of current mid-range chips, ensuring smooth operation for large applications, multitasking, and high-definition content loading [4][5] Market Impact - The launch of the Dimensity 8500 not only enhances the mid-range mobile chip product lineup but also promotes the spread of high-performance technology into the mid-range market, providing users with a more competitive experience and greater choice [4][5]