Xin Lang Cai Jing·2026-01-07 03:30Core Viewpoint - Morgan Stanley (China) Co., Ltd. has officially obtained the qualification of general lead underwriter for non-financial corporate debt financing instruments from the China Interbank Market Dealers Association, marking a significant milestone in its bond business in China and promoting its deep participation in the innovative development and high-level opening of the Chinese bond market [1][3] Group 1: Company Achievements - Since 2004, Morgan Stanley has witnessed and participated in the continuous high-level opening of the Chinese bond market, achieving various qualifications over the years, including market maker in 2008, settlement agent in 2017, and becoming a market maker for Bond Connect in 2018 [1][3] - The approval of the general lead underwriter qualification will further broaden the company's service scope for domestic and foreign issuers and investors, leveraging its dual advantages of "global resources + local expertise" [1][3] Group 2: Market Position - Morgan Stanley has maintained a leading position in the bond underwriting field, with an international bond underwriting scale of nearly $1.7 trillion and a market share of nearly 6% from 2021 to 2025, serving over 9,000 issuance transactions globally [1][3] - The company ranks among the top in the international sovereign and quasi-sovereign bond underwriting field with over 7% market share [1][3] Group 3: Industry Context - The Chinese bond market continues to expand, with a custody balance reaching 196.3 trillion RMB by the end of November 2025, ranking second in the world, and achieving significant growth in both scale and quality [2][4] - As of the end of November 2025, the scale of bonds held by foreign institutions reached 3.61 trillion RMB, with 1,187 foreign institutions entering the market, making the Chinese bond market an important destination for global capital allocation [2][4]