LENOVO GROUP(HK:00992) Jin Rong Jie·2026-01-07 07:29Core Viewpoint - Lenovo (Singapore) Private Limited has applied for a patent for an electronic device designed to suppress the surface temperature of its casing, indicating a focus on thermal management technology in electronic devices [1]. Group 1: Patent Details - The patent, titled "Electronic Device," has a publication number CN121277313A and was filed on June 2025 [1]. - The device features a casing with a protruding part from the bottom surface and an exhaust port located on the side surface, which allows for an expansion of the internal space towards the protruding direction [1]. Group 2: Technical Specifications - The electronic device includes a substrate with a heating element, where one edge is oriented towards the exhaust port [1]. - A cooling module is incorporated, featuring a fan with an outlet to cool the heating element [1]. - A partition separates the upper and lower air flow paths between the substrate's edge and the exhaust port, facilitating efficient airflow management [1].