工信部等八部门：推动智能芯片软硬协同发展 支持突破高端训练芯片、人工智能服务器、智算云操作系统等关键核心技术

Core Viewpoint - The document outlines the implementation opinions for the "Artificial Intelligence + Manufacturing" special action, emphasizing the enhancement of AI computing power supply and the development of intelligent chip technology [1] Group 1: AI Computing Power Supply - The initiative aims to strengthen the supply of AI computing power [1] - It promotes the collaborative development of intelligent chips, focusing on breakthroughs in high-end training chips, edge inference chips, AI servers, high-speed interconnects, and intelligent cloud operating systems [1] Group 2: Infrastructure Development - The plan includes orderly advancement of high-level intelligent computing facility layout [1] - It accelerates the construction of interconnected computing platforms and a national integrated computing network monitoring and scheduling platform [1] Group 3: Service and Resource Enhancement - The document mentions the initiation of pilot projects for intelligent cloud services [1] - It aims to enhance the supply capacity of intelligent computing resources through the deployment of large model integrated machines, edge computing servers, and industrial cloud computing [1]