拥抱科创债高质量发展，科创债ETF广发为投资者提供便捷参与工具

Group 1 - The core viewpoint of the news is the emphasis on the development of the bond market's "Technology Board," which signals a shift from initial establishment to deeper development in supporting technology enterprises [1] - The People's Bank of China and the China Securities Regulatory Commission launched the "Technology Board" for bonds in May 2025, aimed at supporting financial institutions, technology enterprises, and equity investment institutions in issuing technology innovation bonds [1] - As of January 7, 2026, a total of 1,690 entities have issued technology innovation bonds exceeding 1.9 trillion yuan, and there are 24 technology bond ETFs with a total of 317.77 billion yuan [1] Group 2 - The Technology Bond ETF serves as a convenient tool for investors to participate in the bond market's "Technology Board," with the Guangfa Technology Bond ETF (511120.SH) tracking the Shanghai Stock Exchange AAA Technology Bond Index [2] - The Guangfa Technology Bond ETF has a current scale of 10.354 billion yuan and a premium rate of 0.31%, indicating a favorable cost-effectiveness for investors [2] - The fixed income team at Caitong Securities believes that the supply of technology bonds will remain strong due to policy support, and that the demand-driven opportunities for spread compression will continue to exist [3]