我国科研人员让精密电路像“保鲜膜”一样能包裹万物

Core Viewpoint - The research teams from Tianjin University and Tsinghua University have developed an innovative "heat shrink preparation strategy" using liquid metal circuits and thermoplastic films, which represents a significant breakthrough in the field of flexible electronics and smart sensing [1][4]. Group 1: Technology and Innovation - The new technology allows for the creation of high-performance circuits on irregular 3D surfaces, addressing challenges such as conformal fitting, precision control, material compatibility, and reliability [1][4]. - The research team utilized common thermoplastic films as a substrate, which shrink upon heating to tightly wrap around objects, while also developing a semi-liquid metal material with high conductivity and good flow properties to prevent breakage during the shrinking process [4]. Group 2: Applications and Potential - This technology has been successfully applied to create tactile sensor arrays for robotic arms and heads, giving robots a sensitive "electronic skin" [4]. - The potential applications extend to various industries, including: - Smart agriculture, where thin circuits can be attached to fruits and vegetables to monitor temperature and humidity during storage and transportation [4]. - Aerospace, where the technology can be used to create integrated heating circuits for aircraft wings to efficiently remove ice [4]. - Smart healthcare, enabling the development of intelligent bandages for comfortable and precise health monitoring [4].