豪威集团，成功在香港上市

Core Viewpoint - Haowei Group, a semiconductor design company based in Shanghai, successfully listed on the Hong Kong Stock Exchange on January 12, 2026, raising approximately HKD 48 billion through its IPO [2][12]. IPO Details - The IPO involved a global offering of 45.8 million shares, accounting for 3.65% of the total shares post-issue, with a pricing of HKD 104.80 per share, resulting in a net fundraising amount of approximately HKD 46.93 billion [3][12]. - The public offering was oversubscribed by 9.28 times, while the international offering was oversubscribed by 9.73 times [3][13]. - Key cornerstone investors included Boyu Capital, UBS, and several others, contributing a total of USD 279.4 million [3][13]. Company Profile - Haowei Group specializes in the design and development of high-performance integrated circuits (ICs), focusing on three main product lines: image sensor solutions, display solutions, and analog solutions [3][13]. - According to Frost & Sullivan, Haowei Group is projected to be one of the top ten fabless semiconductor companies globally by revenue in 2024, and it ranks as the third-largest supplier of digital image sensors and the largest supplier of automotive digital image sensors [3][13]. Market Performance - On its first trading day, Haowei Group's stock closed at HKD 121.8, reflecting a 16.22% increase from the IPO price, with a total market capitalization of approximately HKD 152.917 billion [3][14]. Underwriting Team - The underwriting team for the IPO included major financial institutions such as UBS, CICC, and others, serving various roles including joint sponsors and coordinators [6][17].