华光新材：公司研发的锡基钎料已批量应用于PCBA制程

Core Viewpoint - Huaguang New Materials is actively involved in the semiconductor industry with its conductive silver paste and tin-based solder materials, currently in the validation phase for its pre-formed high-activity tin solder sheets and conductive adhesive products, which have not yet achieved mass supply [1] Group 1 - The company's tin-based solder materials have been applied in the PCBA process on a large scale [1] - Investors are advised to pay attention to the company's future periodic reports for specific revenue details [1]