上海：“股贷债保担”联动，助科创企业跃升

Core Viewpoint - Shanghai's "Equity-Loan-Debt-Guarantee" linkage mechanism is a comprehensive financial service system aimed at addressing the financing challenges faced by technology and small to medium-sized enterprises, facilitating their growth and innovation [1][2][4]. Group 1: Mechanism Overview - The "Equity-Loan-Debt-Guarantee" mechanism integrates five financial tools: equity financing, loans, bonds, insurance, and guarantees, to effectively address the financing bottlenecks for enterprises at different stages of development [1][2]. - The Shanghai Science and Technology Financial Alliance was established to implement this mechanism, collaborating with various stakeholders to provide tailored financial services throughout the entire lifecycle of technology enterprises [2][3]. Group 2: Financial Support and Impact - Over the past two years, the Shanghai Science and Technology Financial Alliance has facilitated financing exceeding 1 trillion yuan for technology enterprises, covering various innovative entities such as specialized and new enterprises [4]. - Financial institutions have developed customized service plans to meet the unique funding needs of technology enterprises, resulting in a collaborative financial service matrix that supports innovation [5][6]. Group 3: Specific Initiatives and Collaborations - The introduction of the "New Power Loan" has increased credit guarantee limits for small and medium enterprises to a maximum of 20 million yuan, addressing the issues of high financing costs [3][6]. - Various banks, such as CITIC Bank and Bank of China, have implemented collaborative financing models that combine equity and loan services, enabling technology companies to secure necessary funding for their growth [6][7]. Group 4: Future Directions - Shanghai aims to enhance information sharing and resource complementarity among financial institutions, further deepening the "Equity-Loan-Debt-Guarantee" linkage mechanism to explore new financial products and services for technology innovation [9].