燕麦科技：公司在先进封装相关的IC载板测试领域有技术布局与市场推广推进

Group 1 - The core viewpoint of the article is that the company, Oat Technology, is actively engaging in the advanced packaging sector, specifically in the IC substrate testing field, with ongoing technical development and market promotion efforts [2] Group 2 - The company has made a strategic commitment to technology layout in the IC substrate testing area [2] - Market promotion initiatives are being advanced to enhance the company's presence in this sector [2]