精密电路可化身“热缩保鲜膜”包裹万物

Core Insights - The research introduces a "thermal shrinkage preparation strategy" using liquid metal circuits and thermoplastic films, enabling complex electronic circuits to conform to various shapes like shrink wrap, thus advancing high-performance electronic devices from flat to three-dimensional forms [1] Group 1: Research and Development - The collaboration between Tianjin University and Tsinghua University Shenzhen International Graduate School has led to a significant breakthrough in flexible electronics, addressing the challenge of manufacturing high-performance circuits on irregular surfaces [1] - Traditional 3D printing methods are costly and slow, while conventional attachment methods struggle with complex surfaces; the new approach utilizes common thermoplastic films that shrink when heated, allowing for tight wrapping around objects [1] - The team developed a semi-liquid metal material with high conductivity and good fluidity to overcome the brittleness of ordinary metals during the shrinking process, enabling circuit printing on flat films [1] Group 2: Application Potential - The technology has broad application potential across various industries, including smart agriculture, aerospace, and smart healthcare [2] - In smart agriculture, thin circuits can be attached to fruits and vegetables to monitor temperature and humidity during storage and transportation [2] - In aerospace, customized integrated heating circuits can be developed for aircraft wings to enhance de-icing efficiency [2] - In smart healthcare, the technology can be used to create fingertip pulse sensors or smart bandages for precise health monitoring [2]