Jin Rong Jie·2026-01-15 10:31Core Viewpoint - The demand for high bandwidth memory (HBM) driven by artificial intelligence and high-performance computing continues to rise, leading to active performance in the HBM sector on the secondary market. Company Summaries - Unisoc (紫光国微): Latest stock price is 86.69 CNY with a daily increase of +10.00%. The company's HBM products are in the sample system integration verification stage [1] - Chipone (芯源微): Latest stock price is 209.09 CNY with a daily increase of +10.63%. The company has received high recognition from downstream customers in the HBM and 2.5D/3D packaging fields, with multiple products in mass production [2] - Zhongke Feimeng (中科飞测): Latest stock price is 196.98 CNY with a daily increase of +9.20%. The company's graphic wafer defect detection equipment and 3D morphology measurement equipment have passed verification from multiple domestic HBM customers, achieving mass shipments [3] - Yake Technology (雅克科技): Latest stock price is 92.68 CNY with a daily increase of +6.63%. The company's subsidiary UP Chemical is a core supplier of precursors for SK Hynix, supplying materials needed for HBM [4] - JCET (长电科技): Latest stock price is 43.99 CNY with a daily increase of +4.79%. The company has launched the XDFOI high-performance packaging technology platform, which supports advanced packaging requirements for HBM [5] - Shannon Microelectronics (香农芯创): Latest stock price is 170.53 CNY with a daily increase of +4.29%. The company is one of the distributors for SK Hynix and holds agency qualifications for HBM products, positioned in the core supply chain of the industry [6] - Semei Shanghai (盛美上海): Latest stock price is 204.77 CNY with a daily increase of +5.23%. The company’s wet processing equipment and copper plating equipment can be used in HBM manufacturing processes, and related packaging equipment can be used for its 2.5D packaging technology [7] - Lianrui New Materials (联瑞新材): Latest stock price is 64.65 CNY with a daily increase of +6.74%. The company supplies packaging materials for HBM, including ball silicon and Lowα ball aluminum used in GMC (granular epoxy molding compound) [8] - Feikai Materials (飞凯材料): Latest stock price is 26.19 CNY with a daily increase of +6.94%. The company produces and sells epoxy molding compounds (EMC), which are key materials required for HBM storage chip manufacturing [9]