英特尔取得封装上封装集成无源电子器件专利

Core Viewpoint - Intel has obtained a patent for a method and device for packaging integrated passive electronic devices, indicating ongoing innovation in semiconductor technology [1] Group 1: Patent Details - The patent is titled "Method and Device for Packaging Integrated Passive Electronic Devices" [1] - The patent was granted with the announcement number CN109585311B [1] - The application date for the patent was August 2018 [1]