颀中科技：公司计划通过“高脚数微尺寸凸块封装及测试项目”的落地实施，提升显示驱动芯片铜镍金凸块的产能规模

Core Viewpoint - The company aims to enhance its market position in the display driver chip packaging and testing sector through the implementation of advanced packaging projects, thereby solidifying its leadership in the copper-nickel-gold segment [1] Group 1: Display Driver Chip Packaging - The company plans to improve the production capacity of copper-nickel-gold bumps in the display driver chip packaging and testing field through the "high pin count micro-sized bump packaging and testing project" [1] - This initiative will expand the capacity supply in the CP, COG, and COF segments, further refining the company's overall layout and product matrix in the display driver chip packaging business [1] - The company aims to maintain its market-leading position in the display driver chip packaging sector, particularly in the copper-nickel-gold niche [1] Group 2: Non-Display Chip Packaging - In the non-display chip packaging sector, the company leverages its strong expertise in bump manufacturing and wafer thinning to actively develop advanced packaging combinations such as FSM (Front Side Metallization), BGBM (Back Side Thinning and Metallization), and CuClip (Copper Clip Bonding) [1] - The establishment of a flip chip (FC) process for substrate packaging will optimize the company's product layout and broaden the application fields for power chips [1] - The implementation of this fundraising project will enhance the company's full-process service capabilities in non-display chip packaging, driving the expansion of existing processes [1]