Xin Lang Cai Jing·2026-01-17 09:33Core Viewpoint - Intel's EMIB interconnect solution demonstrates advantages over traditional 2.5D technology in advanced chip packaging design, showcasing its application in various products and its potential for next-generation chips [1][14]. Group 1: EMIB Technology and Applications - Intel's EMIB technology has been implemented in several of its products, including Ponte Vecchio, Sapphire Rapids, Granite Rapids, Sierra Forest, and the upcoming Clearwater Forest series [1]. - The company emphasizes its advanced packaging capabilities, which include large-scale packaging using EMIB and other proprietary technologies, specifically designed for data center solutions [1][12]. - EMIB technology allows for efficient and cost-effective connections between multiple complex chips, supporting both 2D and 3D expansions, which traditional 2.5D methods cannot achieve [12][14]. Group 2: Comparison with Competitors - Competitors like TSMC utilize 2.5D and 3D packaging technologies that rely on silicon interposers and TSV (Through-Silicon Vias) for interconnections, which can increase design complexity and costs [3][7]. - Intel points out the drawbacks of 2.5D packaging, such as additional costs for silicon used solely for interconnections and limitations in chip size and flexibility [7]. Group 3: Future Prospects and Industry Position - Intel's advancements in EMIB, including the "T" type packaging and Foveros packaging, have attracted attention from industry giants, intensifying competition in the chip manufacturing sector previously dominated by TSMC [14][15]. - The company aims to leverage its advanced packaging solutions to establish a foothold in the foundry business, particularly with the 14A process node designed for third-party customers [28]. - Intel's upcoming products, such as the Jaguar Shores and Crescent Island GPU, are critical for regaining market share, with a focus on securing orders from third parties [30].