Zhong Guo Neng Yuan Wang·2026-01-19 02:10Group 1 - The core viewpoint of the report highlights the significant price increases in semiconductor packaging services driven by strong demand for AI chips and rising raw material costs, with price hikes expected to range from 5% to 30% across various companies [1][4] - TSMC has raised its capital expenditure guidance for 2026 to between $52 billion and $56 billion, a substantial increase of up to 36.9% from 2025, with 10-20% of this investment allocated to advanced packaging and testing [2] - Major companies are actively expanding capacity to meet the growing demand for advanced packaging, with significant investments announced by firms such as Changdian Technology and Tongfu Microelectronics for new facilities and production lines [3] Group 2 - The semiconductor packaging industry is experiencing structural demand growth, particularly for AI and storage chips, leading to a tightening of standard storage chip packaging capacity as resources shift towards advanced packaging [4] - The increase in prices for raw materials such as gold, silver, and copper is contributing to higher packaging costs, prompting packaging companies to raise prices to maintain profitability [4] - Investment recommendations focus on domestic companies actively engaging in high-end advanced packaging, such as Changdian Technology and Tongfu Microelectronics, as well as potential beneficiaries in the sector [5]