台积电2026年资本开支超预期，先进封装投入占比提升，芯片ETF（159995.SZ）上涨0.15%

Group 1 - The A-share market showed mixed performance on January 19, with the Shanghai Composite Index rising by 0.11%, driven by gains in sectors such as electric equipment, public utilities, and automobiles, while the comprehensive and computer sectors faced declines [1] - The chip technology sector demonstrated strength, with the chip ETF (159995.SZ) increasing by 0.15%, and notable gains in constituent stocks such as Haiguang Information (+3.83%), Chipone Technology (+2.53%), and Zhaoyi Innovation (+2.33%) [1] Group 2 - TSMC held a conference on January 15, providing guidance for capital expenditures in 2026, projected to be between $52 billion and $56 billion, a significant increase of up to 36.9% from the previous year's $40.9 billion [3] - The proportion of capital expenditure allocated to advanced packaging, testing, and mask manufacturing has been revised to 10-20%, up from approximately 10% previously [3] - According to Open Source Securities, TSMC's increased capital expenditure is expected to boost expectations for advanced process capacity expansion, with high-end advanced packaging being essential for AI chips, likely leading to significant demand growth [3]