浪潮通信亮相2026数据中心液冷峰会，分享液冷智算技术成果

Core Insights - The conference focused on liquid cooling technology standardization, AI chip thermal management, phase change cooling, and material innovation, creating a platform for industry-wide communication and collaboration [1] - Inspur Communication shared its latest achievements and practical experiences in liquid cooling intelligent computing centers, providing solutions for technical challenges and promoting green and low-carbon transformation [1] Group 1 - The global computing power construction is accelerating, with AI chip power consumption continuously rising, and strict PUE requirements under the "dual carbon" policy, making liquid cooling the preferred cooling solution for intelligent computing centers [3] - Inspur Communication has launched a full-stack liquid cooling solution, with its self-developed cold plate liquid cooling technology reaching an internationally advanced level, achieving proactive liquid cooling control based on AI predictions, reducing PUE to below 1.15 [3] - To address the long-term coexistence of air cooling and liquid cooling due to an immature supply chain, high costs, and complex scenarios, Inspur Communication introduced a "wind-liquid co-source" multi-scenario solution, effectively solving the temperature zone cooling supply challenges of traditional architectures [3] Group 2 - The company aims to drive technological innovation, focusing on sustainable solutions in the liquid cooling field for scalable applications, promoting the evolution of computing power infrastructure towards greenness and intelligence [3] - Inspur Communication seeks to inject new momentum into global digital transformation and assist the digital economy in achieving high-quality and sustainable development [3]