广汽集团否认未来汽车芯片半数将由格力替代:相关表述并非事实
Xin Lang Cai Jing·2026-01-21 00:58

Group 1 - GAC Group officially denied the rumor that "half of the automotive chips in the future will be replaced by Gree products," emphasizing that the statement is not factual [1] - The rumor originated from a corporate exchange event on January 15, where GAC's chairman, Feng Xingya, visited Gree Electric and discussed industry collaboration with Gree's chairman, Dong Mingzhu [3][5] - Feng Xingya mentioned that GAC developed a climbing version of its high-end brand, Haobo, which uses 1004 chips, all of which have Chinese intellectual property rights [3] Group 2 - GAC clarified that the core topic of the meeting was the integration of "people, vehicles, and home" in a smart ecosystem, and any future collaboration details will be announced through official channels [5] - GAC aims to deepen cross-industry cooperation to enhance the automotive ecosystem and meet user demands more effectively [6] - Gree Electric has established a foundation in silicon carbide chip technology since 2018, with a production capacity of 240,000 pieces per year and a yield rate of 85% for its 6-inch silicon carbide wafer production line [6] Group 3 - Gree's silicon carbide chips are expected to be mass-produced for various applications, including household appliances, photovoltaic energy storage, and logistics vehicles [8] - Silicon carbide chips are considered essential components for electric vehicles, offering over 70% reduction in switching losses and improving overall efficiency by 5%-8%, which can increase the driving range of electric vehicles by 5%-10% [8] - The competitive landscape in the silicon carbide chip market includes both international leaders like Infineon and On Semiconductor, as well as domestic players such as Huawei and BYD [8]

GAC GROUP-广汽集团否认未来汽车芯片半数将由格力替代:相关表述并非事实 - Reportify