Core Insights - On January 16, 2026, the China Materials and Testing Standardization Committee successfully held a group standard review meeting, marking the transition of two standards, "Copper Surface Bonding Performance Specification for High-Speed Printed Circuit Boards" and "Deep Plating Capability Testing Method for Printed Circuit Board Via," from drafting to the preparation stage for formal release [2][19] Group 1: Standards Development - The two standards fill a gap in the testing and evaluation criteria for high-speed printed circuit boards, providing essential technical support and quality assessment for high-end electronic circuit manufacturing [2][19] - The expert group, consisting of representatives from various industry associations and research institutions, conducted a thorough review of the standards, focusing on technical indicators, testing methods, and text expression [4][21] - The successful approval of these standards signifies a move towards more precise and standardized practices in the electronic circuit chemical industry, promoting process optimization and quality upgrades in the high-end PCB sector [6][23] Group 2: Industry Impact - The new standards will provide normative evaluation requirements for electronic circuit chemicals used in AI server PCBs, high-speed PCBs, and multilayer PCBs, enhancing China's standard-setting authority in the global high-speed PCB market [6][23] - Guangdong Guanghua Technology Co., Ltd., founded in 1980, aims to lead in high-performance electronic chemicals and specialized chemical services, contributing to national technological innovation and high-quality industry development [8][25]
PCB产业链协同新进展!CSTM/FC51/TC04两项团体标准通过技术审查