Core Viewpoint - The company, World, is focusing on the future development of diamond micro-drills primarily for PCB board and semiconductor applications, particularly in the processing of holes in high-hardness brittle materials [1] Group 1: Semiconductor Applications - The company has achieved a certain leading advantage in the processing of holes in high-hardness brittle materials for semiconductor applications [1] - The product range, application cases, and revenue scale in this area are gradually increasing [1] Group 2: PCB Board Applications - The processing of holes in PCB boards is identified as a key downstream industry for the company's future development [1] - Currently, this area is still in the research and validation stage and has not yet generated operating revenue [1] - There is significant uncertainty regarding its potential contribution to the company's operating performance in the future [1]
沃尔德:金刚石微钻的未来发展方向主要为PCB板和半导体应用高硬脆性材料的孔加工