Core Viewpoint - The research team from Fudan University has developed a "fiber chip" that is as thin and flexible as a silk thread, providing a new pathway for integrating fiber electronic systems [1][3]. Group 1: Development and Features - The "fiber chip" achieves an integration density of 100,000 transistors per centimeter, enabling digital and analog circuit operations [3]. - It exhibits superior flexibility, capable of withstanding bending, stretching, and twisting, while maintaining stable performance even after washing, exposure to extreme temperatures, and being crushed by a truck [3]. - The team utilized a multi-layer stacking architecture to maximize the internal space of the fiber, allowing for significant transistor integration [3][5]. Group 2: Scalability and Applications - The fabrication method developed is compatible with existing mature photolithography processes, enabling scalable production of the "fiber chip" [5]. - The "fiber chip" opens new applications in brain-machine interfaces, electronic textiles, and virtual reality, integrating power supply, sensing, display, and signal processing functions into a single fiber [5][7]. - In brain-machine interfaces, the technology allows for a closed-loop system integrated within a fiber as thin as a hair, eliminating the need for external signal processing modules [5]. - The "fiber chip" can facilitate the creation of fully flexible electronic textile systems, which can directly weave into fabrics without external processors, enhancing wearability [5][7]. - In virtual reality, the smart tactile gloves utilizing the "fiber chip" can accurately simulate different tactile sensations, improving user interaction with virtual environments [7].
中国学者成功开发“纤维芯片”:丝线般细软、为纤维电子系统集成提供新路径
Zhong Guo Xin Wen Wang·2026-01-22 05:13