我国芯片突破关键难题！弯折变形后仍可使用

Core Insights - The development of flexible electronics has been hindered by the rigidity of chips, which are essential components. A team from Fudan University has successfully created a new type of "fiber chip" by integrating large-scale circuits within elastic polymer fibers, providing a new effective pathway to address the flexibility challenge [1]. Group 1 - The design maximizes the internal space of the fiber, achieving high-density integration within a one-dimensional constrained size [1]. - The team developed a fabrication route compatible with current photolithography processes, utilizing plasma etching to achieve a surface roughness below 1 nanometer, meeting commercial photolithography requirements [3]. - A dense polystyrene film layer is deposited on the elastic polymer surface, acting as a "flexible armor" that protects the circuit from solvents used in photolithography and buffers strain, ensuring stability of the circuit structure and performance after repeated bending and stretching [3]. Group 2 - This breakthrough is expected to provide new pathways for the integration of fiber electronic systems, facilitating a transition from "embedding" to "weaving," which could revolutionize emerging fields such as brain-machine interfaces, electronic textiles, and virtual reality [3].