我国科学家成功研制“纤维芯片”

Core Viewpoint - Fudan University researchers have successfully developed a new architecture for large-scale integrated circuit fabrication within soft, elastic polymer fibers, transforming the concept of "fiber chips" into reality [1][2]. Group 1: Research and Development - The research team, led by Peng Huisheng and Chen Peining, innovatively designed a multi-layer stacked architecture that constructs integrated circuits within the fiber, maximizing internal space utilization [2]. - The team has established a fabrication route that allows for direct photolithography of high-density integrated circuits on elastic polymers [2]. Group 2: Technical Achievements - Initial laboratory results show that the fabricated "fiber chips" can achieve an integration density of 100,000 electronic components (such as transistors) per centimeter [4]. - The efficient interconnection of transistors and other electronic components enables the realization of both digital and analog circuit functions [4]. Group 3: Industry Implications - The new fabrication route not only imparts information processing capabilities to fibers while maintaining their softness but also opens new pathways for fiber electronic system integration [7]. - This advancement is expected to provide new insights for the development of the integrated circuit field [7].