Group 1 - Qiangrui Technology has completed the consolidation of Dongguan Alubao, expecting significant revenue and profit contributions by 2026, with a high market share in supplying liquid cooling heat dissipation modules to clients N and G [1] - The company is deepening cooperation with leading AI server manufacturers both domestically and internationally in liquid cooling testing lines and equipment [1] Group 2 - Chongda Technology's subsidiary, Punowei, plans to invest 1 billion yuan in a functional IC packaging substrate project to enhance competitiveness in the high-end integrated circuit substrate sector, with a construction period from May 2026 to September 2028 [2] - The investment aims to capitalize on the rapid development of edge-side chips and improve production capacity and technological advantages in the semiconductor packaging industry [2] Group 3 - Tuojing Technology announced that the National Integrated Circuit Industry Investment Fund reduced its stake from 17.92% to 16.86% by selling approximately 2.98 million shares between January 13 and 22, 2026 [3] - Zhongwei Company reported that its largest shareholder, Shanghai Chuangtou, completed a plan to reduce its holdings by 1% of the total shares, amounting to approximately 6.26 million shares between January 6 and 21, 2026 [4] Group 4 - Fangzheng Technology expects a net profit of 430 million to 510 million yuan for 2025, representing a year-on-year increase of 67.06% to 98.14% [6] - Qiangyi Co. anticipates a net profit of 368 million to 399 million yuan for 2025, reflecting a growth of 57.87% to 71.17% compared to the previous year [6] Group 5 - Lidong Group's subsidiary has secured a designated aluminum alloy wheel project, with expected sales of approximately 1.37 billion yuan over the project duration [7] - Huakang Clean is expected to be awarded a hospital expansion project [8] - *ST Songfa's subsidiary signed a shipbuilding contract worth 200 to 300 million USD [8]