Core Viewpoint - Shenzhen Chipscreen Biosciences Co., Ltd. has announced that its convertible bond, "Chipscreen Convertible Bond," is expected to meet the redemption conditions based on the stock price performance during a specified period [2][8]. Group 1: Convertible Bond Issuance Overview - The company issued 5 million convertible bonds with a total value of RMB 500 million, each with a face value of RMB 100, approved by the China Securities Regulatory Commission on July 5, 2022 [3]. - The bonds have a maturity period of six years, from July 5, 2022, to July 4, 2028, and began trading on the Shanghai Stock Exchange on July 28, 2022, under the name "Chipscreen Convertible Bond" with the code "118012" [3]. Group 2: Redemption Terms and Expected Trigger Conditions - The redemption terms include a mandatory redemption at 115% of the face value plus the last interest payment within five trading days after maturity [5]. - Conditional redemption can occur if the stock price remains at or above 130% of the conversion price for at least 15 out of 30 trading days or if the remaining unconverted bonds are less than RMB 30 million [6][8]. - As of January 22, 2026, the stock price has been above 130% of the conversion price for 10 trading days, and if this trend continues, the company may decide to redeem the bonds [2][8].
深圳微芯生物科技股份有限公司关于“微芯转债”预计满足赎回条件的提示性公告